NEW DELHI, INDIA: ANSYS has married the advanced computer science of elastic computing, big data and machine learning to the physics-based world of engineering simulation – offering the industry a first look at the future of product development. Its SeaScape architecture enables organizations to innovate faster than the ever. This is the first product taking advantage of this new platform capability to deliver accelerated design optimization of next-generation chips.
Engineering simulation generates tremendous amounts of data – far more than most organizations can effectively leverage for future product designs. A typical integrated circuit, for example, has billions of variables that can be simulated. At the same time the highly specialized engineering supercomputing resources are not keeping pace with the demand for even higher fidelity simulations needed for increasingly complex products. By leveraging such big data technologies as elastic compute and map reduce, SeaScape provides an infrastructure to address these issues in the context of almost any engineering design objective. These results provide more useful insight to product developers early in the design process so they can more quickly innovate their offerings. The company has collaborated with Intel Corporation to optimize SeaScape to take full advantage of the many-core Intel Xeon processor and Intel Xeon Phi processor families.
The combination of big data techniques and simulation capabilities arms SeaHawk users with a broad range of capabilities to reduce size of the chip and its power consumption without sacrificing performance or schedule constraints. Early users have realized an average of 5 per cent reduction in die size, which could result in millions of dollars of savings during production.
“Die size and development time reduction are targets that electronic design engineers have pursued with marginal success given the limitations of today’s in-design solutions,” said John Lee, general manager, ANSYS.
ANSYS SeaHawk bridges the in-design and sign-off needs by bringing unprecedented simulation performance and design insights without sacrificing sign-off accuracy and coverage.