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Broadcom Announces New Automotive Global Navigation Chip

Broadcom has today announced the addition of a new Global Navigation Satellite System (GNSS) wireless connectivity chip to its automotive portfolio.

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Sidharth Shekhar
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BROADCOM

NEW DELHI, INDIA: Broadcom Corporation has today announced the addition of a new Global Navigation Satellite System (GNSS) wireless connectivity chip to its automotive portfolio. The BCM89774 provides improved location and positioning while lowering power consumption for in-vehicle applications and reduces bill of materials (BOM) cost for car makers.

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As the only wideband capture radio technology to offer simultaneous tri-band reception of all visible GNSS satellites including US GPS, European GAL, Japanese QZSS, Russian GLONASS, Chinese BDS and global SBAS augmentation systems, Broadcom’s BCM89774 sets itself apart by delivering original equipment manufacturers (OEMs) one of the most accurate solutions available today. The new chip also improves positioning in dense urban environments and foliage-blocked areas to enhance the consumer experience.

Additionally, by integrating the sensor hub and CPU on a single chip, Broadcom significantly reduces power consumption and lowers BOM cost for automotive manufacturers. Optimized to meet the rigorous standards of the automotive industry, the BCM89774 has been tested to AECQ100 automotive environmental stress requirements, is manufactured in TS16949 certified facilities and offers full production part approval process (PPAP) support.

“Broadcom’s new GNSS connectivity chip for automotive keeps car makers and tier one suppliers ahead of the curve with advanced precision and reduced power consumption while lowering BOM cost,” said Richard Barrett, Broadcom Director of Automotive Wireless Connectivity. “By delivering premium products that meet automotive grade requirements, we are positioned for growth in this accelerating market,” he further added.

Automotive GPS shipments are expected to more than double by 2022, creating significant opportunities among component suppliers and increasing competition for market share.

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