MediaTek Releases Dimensity 7050 and will Debut with Lava Agni 2 Smartphone

MediaTek, a chip manufacturer from Taiwan, has released the MediaTek Dimensity 7050 SoC for mobile devices. The chipset is designed to provide streams MiraVision 4K HDR video processing, Imagiq camera technology, and MediaTek HyperEngine gameplay upgrades to gamers.

Anku Jain, Managing Director of MediaTek India, stated that the company has been working with OEMs in India to provide amazing experiences backed by a wide range of smartphone and smart device technologies.

MediaTek Dimensity 7050 Specifications

The Dimensity 7050, according to MediaTek, uses a fabrication process of 6 nanometers and comes equipped with MediaTek 5G UltraSave for power efficiency.

Dimensity 7050 is based on TSMC's N6 chip creation cycle and flaunts 2x Arm Cortex-A78 execution centers timed at 2.6 GHz and 6x Arm Cortex-A55 power-proficiency centers murmuring at 2.0 GHz. The Arm Mali-G68 MC4 covers the GPU side.

Up to 200 MP camera sensors are supported by the new chipset, and 4K video can be recorded at 30 fps. It can handle displays with a resolution of 2520 x 1080 pixels and a refresh rate of 120 Hz. It also supports LPDDR5 RAM and UFS 3.1 storage. Wi-Fi 6, Bluetooth 5.2, and double SIM 5G network are additionally ready.

According to the statement, "MediaTek Dimensity 7050 allows OEMs to create smartphones with greater CPU performance, low power consumption, and an incredibly smooth gaming experience, and device makers to create attractive, slim, and light 5G smartphones."

Dimensity 7050 to make its debut in the Lava Agni 2 5G Smartphone

MediaTek also said that Lava will be the first OEM in India to use the MediaTek Dimensity 7050 SoC in the upcoming smartphone.

"MediaTek Dimensity 7050 will permit OEMs to make remarkable cell phones with more noteworthy computer chip execution, low power, and an unquestionably smooth game insight," Jain added.

MediaTek chips, according to the company, power nearly 2 billion connected devices annually.