Qualcomm Snapdragon 835 Specifications Leaked Before CES 2017

by January 3, 2017 0 comments

Snapdragon 835 was first announced by Qualcomm in November 2016 with few basic details about its features. The company later released a teaser of their new chipset and added that more details will be revealed at the CES 2017.

The company has so far managed to keep all the details under wrap but a new leak throws light on the potential of Snapdragon 835.

Posted on VideoCardz, the latest leak contains all the slides of all the potential features which we can expect from Qualcomm 835. This chart clearly indicates that this will indeed be a massive upgrade.

Qualcomm and Samsung have collaborated to manufacture the latest Snapdragon premium processor, Qualcomm Snapdragon 835, with Samsung’s 10-nanometer (nm) FinFET process technology.

Samsung’s new 10nm FinFET process, for instance, allows up to a 30 percent increase in area efficiency with a 27 percent improvement in performance or up to 40 percent less power consumption compared to the previous version. These process improvements, combined with a more advanced chip design, can create significant battery life enhancements.



The chipset will come with Snapdragon X16 LTE Modem and will sport Kyro 280 CPU, along with Adreno 540 GPU. The Kyro 280 cores will offer up to 20 percent performance uplift over a range of use cases such as app load time, web browsing and use of Virtual Reality devices or apps.

The new graphic process supports about 60 times as many colors with 25 percent faster rendering. On the camera front, with Qualcomm Spectra Camera ISP the cameras will come with smoother zoom and faster autofocus.

In terms of videos, the chipset will support 10-bit, 4K, 60fps video playback with OpenGL ES, Vulkan, DirectX 12 graphics and HEVC videos. In addition to that, the chipset comes with Qualcomm Haven security, which will make Snapdragon 835 the first to support full biometric suite.

Stay tuned for more information coming up on the ground-breaking Snapdragon 835.

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